Datacom Infrastructure

AMG provides thermal conductive products for the datacom infrastructure industry to effectively solve the problem caused by equipment overheating. For example, thermal conductive pads are regularly put on data processing chips, flash chips, and wireless chips of wireless routers. They can then be fit closely with metal heat sinks and the temperature of the components is significantly decreased, which can ensure the long-term stable operation of wireless routers.

Almost every device used in datacom contains thermal materials such as thermal interface pads, thermal conductive putty, thermal grease, phase change materials, and so on.