Solder Preform

Solder Preforms come in standard shapes such as squares, rectangles, washers and discs. Customized shape can be available upon request.

Alloy Options Au80Sn20
Au88Ge12
Au10Sn90
Au80Cu20
Ag72Cu28
AgCu30Sn10 SAC305（Sn96.5Ag3.0Cu0.5)
SAC405（Sn95.5Ag4.0Cu0.5)
Sn98.5Ag1.0Cu0.5
Sn63Pb37
Sn90Sb10
Sn96.5Ag3.5 In52Sn48
In97Ag3
In100
Pb92.5Sn5Ag2.5
Bi58Sn42
Bi57Sn42Ag1

Application Examples
The solder preforms are used in a variety of applications such as:Die attach of semiconductor, LED and laser chips, thermal fuses, sealing, thermal interface, connectors and cables, vacuum and hermetic seals and gaskets, PCB assembly, mechanical attachment, package/lid sealing.

Feature

Solder preforms are used in conjunction with solder paste to precisely increase the amount of solder.

Solder preforms gaskets eliminate the need for secondary soldering processes.

SMT solder preforms with carrier tape packaging, simple operation and improved economic efficiency

Application of solder preforms

IGBT Module package
Power switching transistor package
Case package
Thick film circuit package
Quality Control Management system: ISO 9001, IATF16949 Uses high purity raw material (Tin - 5N, gold and silver - 4N ) Has strict control on using times of raw materials Composition and melting point testing must be performed on each batch of products. Random inspection according to the standards of GB/T2828S-3
Dimensional inspection
100% appearance inspection
Performance inspection: oxidation, ductility, soldering


Performs strict quality control on the sample, the first finished product and final product.