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Grinding Wheel for Ceramic Encapsulation Material

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Grinding wheels for ceramic encapsulation material are primarily used for planning or outer diameter grinding on ceramic encapsulation devices made of corundum or carborundum. They are also used for plane or surface grinding on carbide alloy products.

Grinding Wheel for Ceramic Encapsulation Material
Technical Parameters:
OUTER DIAMETER (D) OVERALL THICKNESS (T) EFFECTIVE GRINDING WIDTH (K) EFFECTIVE GRINDING THICKNESS (X)
300 5-40 10 5-40
350 7.5
400 10
450 10

Remark: Other specs are available upon request.

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Links：https://www.globefindpro.com/products/21984.html
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