Home Resin Bond Diamond/CBN Grinding Wheel for Polycrystalline silicon

Resin Bond Diamond/CBN Grinding Wheel for Polycrystalline silicon

This product has been discontinued and removed from our shelves.

The resin bond diamond/CBN grinding wheel has a high quality and is used for grinding monocrystalline and polycrystalline silicon. It is suitable for Sigma grinding machines.

Resin Bond Diamond/CBN Grinding Wheel for Polycrystalline silicon
Features Excellent heat resistance. Excellent sharpness. High grinding efficiency. Good finish. 6A2S Grinding wheel
Outer diameter (mm) Overall thickness (mm) Arbor hole diameter (mm) Abrasive width (mm) Abrasive thickness (mm)
75 25 19.05/20 1.5/3 6/10
100 25/30
125 31.75/32
150 30/35
175
200 35/40/50 31.75/32/75
250
Note: other specifications can be customized upon request!

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