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Centerless Resin Bond Grinding Wheel

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This product has been discontinued and removed from our shelves.

The centerless resin bond grinding wheel is used to grind Tungsten rods, ceramic rods and rods made of other materials. It is designed for use with centerless grinding machines in order to meet different grinding performance requirements.

Centerless Resin Bond Grinding Wheel
9A1 Grinding wheel
Outer diameter (mm) Overall thickness (mm) Arbor hole diameter (mm) Abrasive thickness (mm)
300(Type 12) 100 120.03 6/10
150
350 125 127 6/10
400 150 203 5
450(Type 18) 205 228.6 6
255
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Links：https://www.globefindpro.com/products/23248.html
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