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Grinding wheels for Manufacturing of Silicon Wafers

This product has been discontinued and removed from our shelves.

The metal bond grinding wheel is specially designed for the rough grinding, fine grinding and chamfering of GaAs, silicon wafers, etc.

Grinding wheels for Manufacturing of Silicon Wafers
Specification
Outer diameter (mm) Overall thickness (mm) Arbor hole diameter (mm) Fillet radius (mm) Abrasive width (mm)
100 6/8/10 25.4/31.75/32 Customized 1-10
125
150
180
200

Note: other specifications can be customized upon request!


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