PCB Board Layer Stacking Machine

LEAD optimize the stacking process of copper foil and inner layer (prepreg and inner circuit board) to achieve whole-automatic operation of multiple PCB layers, including cutting of copper foil, stack-up of multiple layers, as well as stripping, cutting and packaging of steel plate.

Manufacturing process

The PCB layer stacking machine stacks multiple layers of steel plates, copper foils, inner layer and copper foils using press loading equipment. The resulting semi-finished PCB is stripped from the steel plate by the manipulator, then transferred to the next unit for further processing. The steel plate is then conveyed back to the steel plate cleanser for recycling after cleaning. by press loading equipment. The resulting semi-finished PCB is stripped from steel plate by manipulator, and then transferred to next unit for further processing. The steel plate is conveyed back to steel plate cleanser, which can be recycled after cleaning.

Automatic stack-up
Automatic breakdown
Automatic returning of steel plate


Features

Automation
The multiple PCB layers can achieve on-line automatic cutting and stack-up without the need for manual operation.

Low energy consumption
In order to decrease energy consumption and optimize the control system, the capacity of every unit is calculated, with custom design an essential process.

Components
Manipulator transfer

Uses
Automatic arranging of plates

Parameter
Stacking mode: automatic stack up layers of copper foil, steel plate, copper foil; Stacking accuracy: ±1.5mm; Stacking speed: 12 seconds/layer



Suction hoist for automatic breakdown

Uses
The Suction hoist can separate steel plates and semi-finished PCB

Parameter
Breakdown mode: separated by manipulator Separating speed: 12 seconds/layer Intelligent control: achieve remote monitoring, reserve PLC interface and ERP interface

Suction hoist for automatic overlay

Uses
The Suction hoist can stack the steel plate and multiple layers.

Parameter
Breakdown mode: separated by manipulator Separating speed: 12 seconds/layer