Red Solder Adhesive

This product has been discontinued and removed from our shelves.

The red solder adhesive is also called the SMT series surface mount adhesive. It is made from epoxy resin, providing the function of rapid thermal hardening. This product features high shear viscosity, thus being applicable for the syringe type high-speed surface mount assembly equipment. It is particularly suitable for all kinds of ultra-high speed dispenser, such as HDF.

Due to its superb viscosity and thixotropy, this product is perfect for the steel mesh or copper mesh printing process. It can achieve the favorable molding effect, and also effectively prevent the excessive glue on the printed circuit board.

Applications
Our red solder adhesive is primarily used for the anti-shock property and sealing of the thermostat, bonnet, manifold, water pump, as well as the engines of sedans or luxury cars, and much more. It can be also applied in the machinery, electronics, chemical industry, and other industries. When used for the solder paste or Fluxes & Other Products, this product is able to enhance the surface-mount effect.

So far, our surface mount adhesive has been exported to Iran, Argentina, Ukraine, Belarus, and Colombia.

Main Features

The red solder adhesive can be extruded easily. The façade coated with glue does not hang down loosely.
This product is highly resistant to oil. It is neutral and non-poisonous. No pungent odor will be produced.
In addition, our product can substitute for all pads, thereby offering no corrosion.
The solid does not shrink. It is firm and tough.
Our surface mount adhesive can be easily stripped, which gives convenience for the next maintenance.
Packing: A bottle holds 100mL or 300mL.

Related Names
Fast Curing Epoxy Adhesive | Surface Mount Conductive Adhesive | Bonding Agent