Sn99Ag0.3Cu0.7 High Temperature SMT Lead Free Solder Paste

The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste puts to use the alloy, comprising the 99% tin, the 0.3% silver and the 0.7% copper. With the melting point of 227 degrees Celsius, this product is fit for the reflow soldering process which has relatively high demand. Its preheat temperature ranges from 130 degrees Celsius to 170 degrees Celsius. Its reflow temperature varies from 280 degrees Celsius to 200 degrees Celsius.

In addition, the flux contained in our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste takes advantage of the highly reliable low-ion type halogen activator. In other words, our product features extremely high reliability, even if it is not cleaned after the reflow soldering process.

The no-clean type lead free solder cream is applicable for the electronic PCB and SMT. There is no need to clean our product with other chemical agent. This product can be spread on the circuit board automatically, which offers much convenience and environmental protection.

The water-soluble type tin paste adopts the plate-cleaning water or other simple agents to eliminate the slag.

Main Specifications

Specification	Sn99-Ag0.3Cu0.7
Appearance	Adhesive paste in grayish black
Weight	500g/bottle, 10kg/box

Chemical Composition

Type	Chemical Composition (wt. %)
	Sn	Pb	Sb	Cu	Ag	Fe	Al	Cd
Sn99Ag0.3Cu0.7	Bal			0.7±0.2	0.3±0.1

Applications
Our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste is ideal for use in the precise computer motherboards, phone motherboards, printed circuit boards (PCB), as well as a variety of high-precision electronic circuit boards. It is dedicated for the LED, SMT, electronic mount technology, and the plug-in components.

Packing

The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste can be classified as the bottle packing type and the syringe packing type. Each bottle holds the solder cream of 500g, and each syringe can load the solder cream of 100g.
The packaging material can be separated into the inner layer of a bubble box and the outer layer of a carton, so as to better secure the transportation.
The dimension of each carton is 34.5*27.5*23.5cm (length*width*height). The gross weight is 10kg.
The minimum order quantity, abbreviated as MOQ, is 50kg.
The OEM service is available. We can produce the logo of our customers, and the specific price is negotiable.
Our production capacity for the lead free solder wire is 80 tons per month.

Pricing and Payment Methods

We accept various types of international price terms, such as EXW, CFR, CIF, FOB, and more.
We adopt such payment methods as T/T, West Union, cash, and some others.

Related Names
Soldering Flux Paste | Tin Soldering Paste | Electronics Solder Paste