Laser Marking Machine for Wafer

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Model: TH-WLMS Series

Introduction
1. The laser marking machine for wafer is professional equipment specially designed for semiconductor industry.
2. This laser marker adopts world advanced air-cooled all-solid-state laser as light source.
3. The high-speed digital galvo scanning system brings the highest possible precision.
4. The high-precision 2D linear motor worktable and direct-drive rotary platform guarantees fast and precise wafer marking.
5. Its positioning precision can be 7um with the special CCD automatic positioning system.
6, The marking area can be from 2 inches to 12 inches upon request.

Application
The laser marking machine for wafer is widely applicable to all kinds of wafers, 2D matrix code of phone mainboard and special fine marking.

Technical Data

Specification/Model	TH-WLMS series
Laser Generator	Q-switched diode-pumped all- solid-state laser/RF
Laser Medium	Nd: YVO4/Co2
Laser Wavelength	355nm/10.6 um
Rated Power	1w @ 25KHz
Location precision of linear motor work table	±2 um
Repetition precision of linear motor work table	±1 um
Effective travel of linear motor work table	272mmx304mm
CCD automatic positioning precision	7 um
Min. Character Size	0.1 mm
Line Width	≤40 um

Sample

Sample of the laser marking machine for wafer

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