JT-503/JT-G751 Dry Lamination Adhesive

JT-503/JT-G751Dry Lamination Adhesive

TheJT-503/JT-G751 dry lamination adhesive suits for the bonding process ofplastic/plastic, Al foil (film)/plastic and other high-end multilayer packagingmaterials. As a kind of functional adhesive, our product shows theadvantages of high solid content, low viscosity, big initial and final bondingstrength as well as good resistance to 100°C boiling treatment. Moreover, it isalso resistant to acid, alkali and hot media.

The Al/plastic laminates manufactured using this bondingmaterial is universally adopted for various air conduits and Al foilshielding layer of communication cables. Additionally, our adhesion agent fits for high and low speedprinting machines.

Applicable Substrates
Our dry lamination adhesive isapplicable for BOPP, CPP, VMCPP, PET, NY, PE and other films, and it is oftenused in places where good chemical resistance is required.

Technical Data

Glue Amount

Working Concentration

Note: The symbol “*” means theamount of curing agent is adjustable within this range depending on specificapplication and ambient humidity.

Calculation Formula for Dry Glue
Cw=KhN, where
Cw is the dry glue amount(g/m2)
K is the correction factor whose typical values are within 0.25-0.17
h is the cell depth of aniloxroll (μm)
N is the solid content of adhesive (%)

Calculation Formula for Diluent
Wx=(Wz×Nz Wg×Ng)/N-(Wz Wg), where
Wx is the weight of diluent (kg)
Wz is the weight of mainagent (kg)
Nz is the solid content ofmain agent (%)
Wg is the weight of curingagent (kg)
Ng is the solid content of curing agent (%)
N is the working concentration after proportioning (%)