The JF-PMAg02 is a nanosilver paste specifically designed for pressure silver sintering processes. It possesses excellent electrical conductivity and maintains stable performance during extended printing processes. After sintering, the resulting silver layer is uniformly dense, providing high reliability and superior heat conduction for bonding power device chips.
FeaturesItem | Data | Appendix |
Viscosity | >20 Pa·s | At 0.5 rpm |
Density | 5.0 g/cm3 | Before sintering |
Solid Content | >82% | TGA |
Resistivity | <6 μΩ·cm | Four-point probe |
Coefficient of Thermal Expansion | 20 ppm | TMA |
Thermal Conductivity | >200 W/(m·K) | Laser flash |
Applicable Surface | Silver | |
Storage Temperature | -10℃ ~ 0℃ |