Electronic Hot Melt Adhesive
ElectronicHot Melt Adhesive
Our electronic hot melt adhesive has manyadvantages, such as high peel strength and great resistance to hightemperature, heat and chemical corrosion. With good adhesive property, the hot melt glue can bondvarious plastic and metal substrates firmly, especially substrates of suchdigital products as mobile phones, computers, etc. Economical and reliable, ourproducts are now widely used in electronic and microelectronic industries.
Specifications
| Product | Appearance | Melt viscosity cp | Open time (affected by temperature, substrate) s | Sizing temperature ℃ | Application |
| PUR-8665 | Water white solid | 8000±500/120 ℃ | 360 | 110~130 | The electronic hot melt adhesive is suitable for bonding plastic substrates. |
| PUR-8810 | Water white solid | 6000±500/110 ℃ | 90 | 110~130 | It is suitable for bonding a variety of plastic and metal substrates, such as ABS, polycarbonate, FRP, polyester, acrylic, epoxy resin, PVC, aluminum alloy, stainless steel, copper, ferro alloy, etc. |
Packing
Our electronic hot melt adhesive ispacked in a 30g plastictube.
With years of experience in the adhesive industry, our company is able toprovide an extensive line of hot glue for bonding, coating and sealing ofelectronic components. With a hot melt tool kit, customers can use our productsinstantly. However, if the production equipment hasn’t been used for a long time, please firstclean it before using our adhesive.
Links：https://www.globefindpro.com/products/91292.html
