The JF-PMAg01 is a nanosilver paste designed for pressureless sintering processes. It exhibits excellent electrical conductivity and maintains a stable amount of adhesive during extended dispensing processes. After sintering, the silver layer formed is uniformly dense, allowing for efficient heat dissipation in high-power devices. Its thermal conductivity far surpasses that of traditional soldering materials.
FeaturesItem | Data | Appendix |
Viscosity | >20 Pa·s | At 0.5 rpm |
Density | 4.8 g/cm3 | Before sintering |
Solid Content | >80% | TGA |
Resistivity | <6 μΩ·cm | Four-point probe |
Coefficient of Thermal Expansion | 20 ppm | TMA |
Thermal Conductivity | >200 W/(m·K) | Laser Flash |
Applicable Surface | Silver | |
Storage Temperature | -10℃ ~ 0℃ |