Home JF-PMAg01 Pressureless Silver Sintering Paste

JF-PMAg01 Pressureless Silver Sintering Paste

The JF-PMAg01 is a nanosilver paste designed for pressureless sintering processes. It exhibits excellent electrical conductivity and maintains a stable amount of adhesive during extended dispensing processes. After sintering, the silver layer formed is uniformly dense, allowing for efficient heat dissipation in high-power devices. Its thermal conductivity far surpasses that of traditional soldering materials.

JF-PMAg01 Pressureless Silver Sintering Paste
Features
High thermal conductivity High electrical conductivity Steady dispensing performance Excellent RBO control Cross-section analysis Parameters
Item Data Appendix
Viscosity >20 Pa·s At 0.5 rpm
Density 4.8 g/cm3 Before sintering
Solid Content >80% TGA
Resistivity <6 μΩ·cm Four-point probe
Coefficient of Thermal Expansion 20 ppm TMA
Thermal Conductivity >200 W/(m·K) Laser Flash
Applicable Surface Silver
Storage Temperature -10℃ ~ 0℃

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