Vacuum Pick-up
, Bsoldering381 ESD
Features
1. ESD safe design, no damage to sensitive components.
2. Scientific design of suction pen, light structure.
3. Vacuum suction stepless adjustable, single suction pen, powerful suction force can reach to 120g.
4. Bsoldering381 can control the pick-up and placing of chips accurately and effectively, avoid shaking when placing.
5. Pedal switch control, energy saving, long lifetime.
6. Suction nozzles and pads can be used together and interchangeable.
Specifications
| Power | 7W |
| Pump | Diaphragm |
| Max suction | 0.03M Pa |
| Suction pad | Conducting silicon rubber |
| Dimensions | 130(L)*160(W)*110(H)mm |
| Weight | About 1.55kg |
Accessories
| Straight suction nozzle | 0.7mm, 1.45mm(Inner diameter) |
| Bend suction nozzle | 0.7mm, 1.45mm(Inner diameter) |
| Suction pad | 6mm, 7mm, 8mm, 10mm(diameter) |
, Bsoldering382A ESD
Features
1. Easy to pick-up and place chips, resistors, capacitors and various round and micro components.
2. Built-in pump. The powerful suction force can reach to 120g.
3. ESD safe design.
4. Suction nozzles and pads can be used together and interchangeable.
Specifications
| Power | 10 W |
| Pump | Diaphragm |
| Max suction | 0.03M Pa |
| Suction pad | Conducting silicon rubber |
| Dimensions | 185(L)*157(W)*105(H)mm |
| Weight | About 2.5kg |
Accessories
| Suction pen | 123(L)*10(external diameter) |
| Soft hose | 1100(L)*6(external diameter) |
| Straight suction nozzle | 0.7mm, 1.45mm(Inner Diameter) |
| Bend suction nozzle | 0.7mm, 1.45mm(Inner Diameter) |
| Suction Pad | 6mm, 7mm, 8mm, 10mm(Diameter) |
Links：https://www.globefindpro.com/products/95913.html
