8 Layer PCB
8 Layer PCB
Specifications
4
8 Layer PCB with BGA
Base material: FR4, 1.6mm
Copper thickness: Inner (17um), Outer (1oz)
Min. track width/space: 0.1mm
Impedance control: /-10%
Min. holes: 0.15mm
Surface treatment: Immersion gold
6
8 Layer PCB with BGA
Base material: FR4, 2.0mm
Solder mask: Green *2
Silkscreen: White
Min. track width/space: 0.13mm
Min. hole: 0.25mm
Surface treatment: Immersion gold
Profile: Milling with tooling holes and fiducial marks
| Structure | ||
| Layer Count | 1, 2, 4, 6, 8, 10,12 | 1, 2, 4, 6, 8, 10, 12, 14, 16 |
| HDI Technology | For Sample | Run Production |
| Board Thickness(Min) | 24mil | 24mil |
| Board Thickness(Max) | 126mil | 126mil |
| Copper Foil | ||
| Copper Foil Outer Layer | 1/2oz-10oz | 1/2oz-10oz |
| Copper Foil Inner Layer | 1/2oz-3oz | 1/2oz-3o/z |
| Drill | ||
| Plating Hole Tolerance | /-3mil | /-3mil |
| Non-plating Hole Tolerance | /-2mil | /-2mil |
| Min. Drill Bit | 0.25mm | 0.25mm |
| Dielectric Thickness | ||
| Core Thickness (Min) | 3mil | 3mil |
| Dielectric Thickness (prepreg) | 2mil | 2mil |
| Finished Board Thickness Tolerance | /-10% FBT>=50mil/-12% 24mil=<50mil/-3milFBT<24mil | /-10% FBT>=50mil/-12% 24mil=<50mil/-3milFBT<24mil |
| Solder Mask | ||
| Solder Mask Dam (Min) | 3mil | 3mil |
| Solder Mask Opening (Min) | 2.5mil | 2.5mil |
| Solder Mask Plug Hole Size | 0.3mm-0.7mm | 0.25mm-0.7mm |
| Registration Capability | ||
| Layer to Layer | 3mil | 3mil |
| Plating Capability | ||
| Aspect Ratio (Mechanical) | 10 : 1 | 12 : 1 |
| Aspect Ratio (Laser) | 0.8 : 1 | 0.8 : 1 |
| Electrical / RF Capability | ||
| Min. Line Width/Space (Inner ½oz) | 4mil / 4mil | 4mil / 4mil |
| Min. Line Width/Space(Inner1oz) | 4mil / 4mil | 4mil / 4mil |
| Min. Line Width/Space(Outer1/2oz) | 4mil / 4mil | 4mil / 4mil |
| Line Tolerance | /-20% | /-20% |
| Impedance | ||
| Impedance Control | YES | YES |
| Impedance Tolerance | /-10% | /-10% |
| Outline | ||
| Routing Tolerance | /-5mil | /-5mil |
| Punching Tolerance | /-4mil | /-4mil |
| V-cut Angle | 30degree, 45degree, 60degree | 30degree, 45degree, 60degree |
| V-cut Tolerance | /-3degree | /-3degree |
| V-cut Web Thickness Tolerance | /-3mil | /-3mil |
| Surface Finished | ||
| Organic Solderability Preservative | Yes | Yes |
| Electroless Nickel /Immersion Gold | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Lead Free HASL | Yes | Yes |
| Immersion Tin | Yes | Yes |
| E-Test | ||
| Test Voltage | 25v-250v | 25v-250v |
| Insolation Resistance | 2M ohms-100M ohms | 2M ohms-100M ohms |
| Continuity | 5 ohms–1k ohms | 5 ohms –1k ohms |
| Others | ||
| Lead Time | Prototype: Single side: 2 daysDouble side: 3 daysMultilayer: 6 days | Production: Single side: 5-7 daysDouble side: 7 daysMultilayer: 9 days |
Honya International is a professional 8 layer PCB manufacturer in China. In addition to 8 layer printed circuit board, we also produce aluminium base PCB, single side PCB, flexible circuit, and others. Our high quality and competitively priced products have won us a great number of satisfied clients from UK, France, Netherlands, India, Italy, and more.
Thanks for visiting our website! If you have any questions about our multilayer printed circuit board, please contact us. The staff at Honya International is happy to assist you.
Links：https://globefindpro.com/products/105393.html
