Low Viscosity Electrical Potting Compounds, ZS-GF-5299E

ZS-GF-5299E RTV Silicone Potting Compounds Description

The ZS-GF-5299E RTV silicone potting compounds is a low viscosity, two-component product for sensor potting. It cures at room temperature or via heating, and features a faster curing at higher temperatures, with no byproduct production during curing. This allows it to be used for substrates on metals and plastics such as PC (Poly-carbonate), PP, ABS, PVC and more. Temperature range of -60℃ to 220℃, and fully satisfies EU RoHS and REACH standards.

Typical applications Potting, encapsulating and thermal protection of sensors Potting, encapsulating and thermal protection of electrical and electronic components like power modules Technical specs

Performance index		Component A	Component B
Uncured properties	Appearance	Black, gray, white fluid	White fluid
	Viscosity (cps)	1500～2500	1500～2500
	Mix ratio/A:B by weight	1∶1
	Mixing viscosity (cps)	1500～2500
	Working time at room temperature (min)	30-50
	Cure time at room temperature T (h)	T+5℃: 1-3
		T: 3-5
		T-5℃: 5-9
Cured properties	Hardness (Shore A)	40-50
	Thermal conductivity[W/m.K]	≥0.6
	Dielectric Strength (kV/mm)	≥15
	Dielectric constant (1.0MHz)	2.4～3.0
	Volume resistivity (Ω·cm)	≥1.0×1013
	Specific gravity (g/cm3)	1.56±0.02

Note:
The above uncured properties are measured at room temperature where the product is produced. Mechanical and electrical properties are tested after the products are fully cured.