Home HD-N220 Ultrasonic Machines Used for Baby Diaper Layer Bonding

HD-N220 Ultrasonic Machines Used for Baby Diaper Layer Bonding

HD-N220 ultrasonic machine is designed for baby diaper layer bonding. It is highly automated and can finish the whole process such as material feeding, laminating, embossing, separating, bundling, receiving, etc. Its capacity can up to 60m/min in ideal situation, so it can meet most of mass manufacturing demands.

HD-N220 Ultrasonic Machines Used for Baby Diaper Layer Bonding
Specifications Dimension: 4500*5500mm*1500mm Voltage: 110V/220V/380V Power: 3000W Air Pressure: 3-7kg/cm² Capacity: 45~ 55m/min Product Samples

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