Electronic Potting Silicone

Name: Addition cure encapsulant and potting compound
Number: HY-221
Count: 249
Distribution time: 2010-06-18
Usage:Filling for LED,LCD electronic display, circuit board.

Applications
It is applicable to sealing,bonding,coating for electronic parts.　
HY-221 is two-component addition cure silicone rubber which can be divided into a transparent type and a flame resistant type. The product, which can be vulcanized under room temperature or moderate temperature with low viscosity, easy mixing and pouring, is applicable to bulk pouring with excellent electrical performance.

Features
The product has low shrinkage and non-corrosive; the silicone rubber can be used for a long period at the temperature of -60℃~250℃ with the characteristics of moisture-proof and waterproof, radiation-proof as well as weatherable and anti-ageing.
Note: Vulcanizing under the room temperature or heat curing according to different requirements.

Using instruction
1. Mix the component A and component B evenly according to the proportion and can be used after deaired.
2. The vulcanizing time depends on the temperature in case of heat curing is required. The higher the temperature, the shorter the vulcanizing time, and the thicker the product, the longer the time.
3. The flame resistant type silicone may produce deposit after long-time placement. Mix the component A and component B respectively and evenly according to the proportion before using.