Home YIHUA-8508D Hot Air Rework Station

YIHUA-8508D Hot Air Rework Station

Features
1. YIHUA-8508D hot air rework station applies the SAMSUNG SCM and PID program to accurately controlthe working temperature, thereby safeguarding delicate components.
2. Designed with manual/automatic functions, the air gun can be set accordingto the application conditions. In the case of frequent use, it can be manuallyset to save the repeated heating time.
3. The desoldering rework station has a wind ball used to indicate the pumppressure.
4. Shell of the whole machine unit is manufactured from ferroalloy. It isresistant to abrasion, damage, and high temperature.
5. This hot air rework station applies the handle shell made of uniquetemperature resistant materials. The handle shell is beautiful, and comfortableto use. It withstands temperature extremes.
6. It uses the highlyreliable ceramic skeleton heater which can be used for a long time.
7. A stainless steel air outlet of the handle has good heat conductivity, andperfectly resists abrasion and oxidation.
8. The YIHUA-8508D hot air rework station applies spiral wind design. It usesthe high quality air pump to produce spiral, soft and uniform air flow.

YIHUA-8508D  Hot Air Rework Station

Parameters
Working VoltageAC 220V±10% 50Hz
Output Power550W
300℃ Constant Temperature Power (Rapid PID program control, energy-saving and province electricity)200W±10%
Working Condition0~40℃ relative humidity<80%
Storage Temperature-20~80℃ relative humidity<80%
Dimensions255*188*125mm
Weight3.6KG
Temperature Range100℃~450℃
Air Supply ModePump air supply
Air Flow24L/min (Max.)
Temperature Stability±5℃ (static state)
Display ModeLED
Temperature Correction ModePID Digital program calibrate
PID Temperature Correction Cycle200ms
Heating ElementCeramic skeleton heater

Standard Configuration
Desoldering Station:1pc
Manual: 1pc
Air Gun Handle:1pc
Nozzle:3 (5mm 8mm 10mm)
IC Extractor:1pc
HandleFrame: 1pc


Application
YIHUA-8508D hot air rework station is developed for desolderingdifferent components, including SOIC, CHIP, QFP, PLCC, BGA, etc. Particularly,it is suitable for small area, high-precision desolderingof SMD components.


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