Solder Sphere

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Solder spheres are suitable for BGA (ball grid array), CSP (chip scale packages), semi-conductor packaging, SMT rework repair, etc.

Specifications
Main elemental composition: Tin (Sn) 96.5, silver (Ag) 3.0, copper (Cu) 0.5; Alloy density: 7.4g/cm3 ( 20℃); Solidus and liquidus temperatures: 217℃～219℃; Temperature: 300℃ 10℃/-0℃; Anti-oxidation time: 30min 5min/-0min； The liquid tin always remain silvery-white; Features: Phosphorus free, good solderability and high resistance to oxidation; Product Appearance

Silvery-white, smooth surface, no impurity, low color difference for each batch (△E＜0.3), fully spherical in shape;

Size and Tolerances (Unit: μm)

Diameter	Tolerance	Diameter	Tolerance
≥500	±20	＜500	±10

Roundness (Unit: μm)

Diameter	Sphericity（%）	Diameter	Sphericity（%）	Diameter	Sphericity（%）
100～150	≧80	351～550	≧92	651～760	≧94
151～350	≧90	551～650	≧93	761～1000	≧95

Oxygen Content

Diameter	Oxygen Content (%)	Diameter	Oxygen Content (%)
≦300	≦0.0026	＞300	≦0.0015

Tests

Anti-oxidation test
Reflow soldering test
High temperature and humidity test

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Links：https://globefindpro.com/products/6750.html

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