Clean Non-Oxidizing High Temperature Chamber

Clean non-oxidizing high temperature chambers can prevent products from oxidation under high temperature. It is ideal for application in semiconductor, liquid crystal, electronic products and precision appliance industries.

Reference Standards GB/T2423.2-2008 Environmental Testing for Electric and Electronic Products - Part 2: Test B: High Temperature Test Method GJB150.3A-2009 Military Equipment Laboratory Environment Test Method Part 3: High Temperature Test IEC68-2-2 Test B: Dry heat GB/T 25915.1-2021 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration Features High temperature resistant high efficiency filter, keeping the internal Cleanliness level of the high temperature chamber (in a class 10000 cleanroom) at grade 100 through vertical circulation. Circular arc in the chamber designed to prevent accumulation and settlement without dead angle. The inner chamber adopts jacket design, ensuring the cleanliness of the inner chamber during cooling. Using air to achieve rapid cooling, saving a lot of nitrogen compared with traditional models. Special temperature controller. Small temperature fluctuation and deviation. Manually adjusted nitrogen flow and display of the float flowmeter scale The solenoid valve controls the nitrogen flow to decrease when the temperature is stable (after oxygen content is reached). Optional Function Automatic regulation of inert gas flow by electronic flowmeter software Online oxygen concentration analyzer Specifications

Model		SVC-NO-91		SVC-NO-216		SVC-NO-512
Effective Volume (L)		91		216		512
Temp. Range (℃)	Min	RT 30
	Max	250	350	250	350	250	350
Temp. Uniformity (℃)		≤3.0
Temp. fluctuation (℃)		≤ ±0.5
Temp. deviation (℃)		±1.5
Cleanliness level		Class 100 (environment cleanliness level class 10000)
Residual oxygen concentration in the chamber		20 ppm minimum (depending on the purity of inert gas used)
Consumption of high-purity inert gas (N2) when the residual oxygen concentration in the chamber≤100ppm		≤30L/min (≤40min down to)		≤60L/min (≤40min down to)		≤120L/min (≤40min down to)
		≤7L/min (concentration maintaining)		≤14L/min (concentration maintaining)		≤28L/min (concentration maintaining)
Consumption of high-purity inert gas (N2) when the residual oxygen concentration in the chamber50ppm		≤30L/min (≤60min down to)		≤60L/min (≤60min down to)		≤120L/min (≤60min down to)
		≤10L/min (concentration maintaining)		≤20L/min (concentration maintaining)		≤40L/min (concentration maintaining)
Cooling rate (℃/min)		250℃ series, no load, from 225 ℃ to 60 ℃, ≤100min
		350℃ series, no load, from 350 ℃ to 60 ℃, ≤180min
Heating rate (℃/min)		no load, from RT 15 ℃ to 200 ℃, ≤60min
Internal Dimensions(mm)	w	450		600		800
	h	450		600		800
	d	450		600		800
External dimensions(mm)	W	950	1050	1100	1200	1300	1400
	H	1560	1660	1710	1810	1910	2010
	D	1450	1550	1600	1700	1800	1900
Maximum power (not the sum of all power) (KW)		2.5	3.5	4.5	5.5	7.5	8.5
Leakage switch 4P (A)		10	10	10	16	16	16
Noise (dB)		Less than 65 dB (measured 500 mm from the display screen)