Oxidation-free high temperature chamber can prevent products from oxidation under high temperature. It is suitable for application in many industries, such as semiconductors, liquid crystal, electronic products and precision appliance.
Reference Standards GB/T2423.2-2008 Environmental Testing for Electric and Electronic Products - Part 2: Test B: High Temperature Test Method GJB150.3A-2009 Military Equipment Laboratory Environment Test Method Part 3: High Temperature Test IEC68-2-2 Test B: Dry heat Features Self-developed temperature controller A fuzzy adaptive PID control method, saving energy Wide temperature control range Small temperature fluctuation and deviation Manually adjusted nitrogen flow and display of the float flowmeter scale The solenoid valve controls the nitrogen flow to decrease when the temperature is stable (after oxygen content is reached) Optional Function Automatic regulation of inert gas flow by electronic flowmeter software Online oxygen concentration analyzer SpecificationsModel | SNO-216 | ESNO-216 | SNO-512 | SNO-512 | SNO-1000 | ESNO-1000 | |||||||
Effective Volume (L) | 216 | 512 | 1000 | ||||||||||
Temp. Range (℃) | Min | RT 30 | |||||||||||
Max | 250 | 350 | 250 | 350 | 250 | 350 | 250 | 350 | 250 | 350 | 250 | 350 | |
Temp. uniformity (℃) | ≤1.0 | ||||||||||||
Temp. fluctuation (℃) | ≤ ±0.5 | ||||||||||||
Temp. deviation (℃) | ±1.0 | ||||||||||||
Cooling rate (℃/min) | 250℃ series, no load, from 225 ℃ to 60 ℃, ≤100min | ||||||||||||
350℃ series, no load, from 350 ℃ to 60 ℃, ≤180min | |||||||||||||
Heating rate (℃/min) | no load, from RT 15 ℃ to 200 ℃, ≤60min | ||||||||||||
Residual oxygen concentration in the chamber | 20 ppm minimum (depending on the purity of inert gas used) | ||||||||||||
Consumption of high-purity inert gas (N2) when the residual oxygen concentration in the chamber≤100ppm | ≤60L/min (≤40min down to) | ≤120L/min (≤40min down to) | ≤240L/min (≤40min down to) | ||||||||||
≤14L/min (concentration maintaining) | ≤28L/min (concentration maintaining) | ≤56L/min (concentration maintaining) | |||||||||||
Consumption of high-purity inert gas (N2) when the residual oxygen concentration in the chamber≤50ppm | ≤60L/min (≤60min down to) | ≤120L/min (≤60min down to) | ≤240L/min (≤60min down to) | ||||||||||
≤20L/min (concentration maintaining) | ≤40L/min (concentration maintaining) | ≤80L/min (concentration maintaining) | |||||||||||
Internal Dimensions(mm) | W | 600 | 800 | 1000 | |||||||||
H | 600 | 800 | 1000 | ||||||||||
D | 600 | 800 | 1000 | ||||||||||
External dimensions(mm) | W | 860 | 960 | 1100 | 1200 | 1060 | 1160 | 1300 | 1400 | 1260 | 1360 | 1500 | 1600 |
H | 1430 | 1330 | 1510 | 1610 | 1530 | 1630 | 1710 | 1810 | 1730 | 1830 | 1910 | 2010 | |
D | 1500 | 1400 | 1600 | 1700 | 1600 | 1700 | 1800 | 1900 | 1800 | 1900 | 2000 | 2100 | |
Maximum power (not the sum of all power) (KW) | 4.5 | 6.0 | 4.5 | 6.0 | 7.5 | 9.0 | 7.5 | 9.0 | 11.0 | 13.0 | 11.0 | 13.0 | |
Leakage switch 4P (A) | 16 | 16 | 16 | 16 | 16 | 20 | 16 | 20 | 25 | 25 | 25 | 25 | |
Noise (dB) | Less than 65 dB (measured 500 mm from the display screen) |