Thermal Conductive Putty

Thermal Conductive Putty

AMG’s GPU series thermal conductive putty features a strong plasticity and can be used to fill uneven gaps between heating components and heat sinks or shells in order to efficiently and effectively lower electronic component temperatures.

Features

AMG provides a variety of GPU thermal conductive putty and customization services.

High thermal conductivity, max. 6.0 W/m·K Suitable for automatic dispensing Soft, highly compressible and highly plastic, allowing it to uniformly cover component surfaces without holes. Excellent insulation No flowing, no curing, no volatilizing, non-stick High and low temperature resistant, water steam resistant, aging resistant Adjustable parameters and packaging scales RoHS, REACH certifications

Applications Computer server: microprocessors, cache chip Portable electronic equipment: game player Communication devices: wireless module, router Household appliances: LCD TV LED Lighting equipment Power supply
Heat pipe radiator

Main Parameters
Thermal conductivity: 1.0~6.0 W/m·K
Temperature range: -55~+200 ℃


Packaging EFD syringe, sealed can, 25 kg pail Suitable for automatic dispensing


Optional thermal putty